AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |
Back to Blog
Highfive technologies4/3/2023 ![]() While developers of bleeding-edge chips will be quick to jump to N2, many of TSMC's more rank & file customers will stick to various N3 technologies for years to come.Īt its TSMC Technology Symposium 2022, the foundry talked about four N3-derived fabrication processes (for a total of five 3 nm-class nodes) - N3E, N3P, N3S, and N3X - set to be introduced over the coming years. Another reason why TSMC and its customers need multiple versions of N3 is because the foundry's N2 relies on all-new gate-all-around field-effect transistors (GAA FETs) implemented using nanosheets, which is expected to come with higher costs, new design methodologies, new IP, and many other changes. ![]() ![]() This means that TSMC will need to offer enhanced versions of N3 in order to meet the needs of its customers who are still looking for a performance per watt improvement as well as transistor density bump every year or so. With N3, TSMC's new node introduction cadence is going to expand to around 2.5 years, whereas with N2, it will stretch to around three years. N3: Five Nodes Over Next Three YearsĪs fabrication processes get more complex, their pathfinding, research, and development times get stretched out as well, so we no longer see a brand-new node emerging every two years from TSMC and other foundries. One of the key things that TSMC is announcing today are its leading-edge nodes that belong to its N3 (3 nm class) and N2 (2nm class) families that will be used to make advanced CPUs, GPUs, and SoCs in the coming years. ![]() on Thursday kicked off its 2022 TSMC Technology Symposium, where the company traditionally shares it process technology roadmaps as well as its future expansion plans. ![]()
0 Comments
Read More
Leave a Reply. |